Location: Commodity Utilization ResearchTitle: Optimization and practical application of cottonseed meal-based wood adhesive formulations for small wood item bonding
Submitted to: International Journal of Adhesion and Adhesives
Publication Type: Peer Reviewed Journal
Publication Acceptance Date: 9/24/2019
Publication Date: 10/4/2019
Citation: He, Z., Cheng, H.N., Klasson, K.T., Ford, C., Barroso, V.A.B. 2019. Optimization and practical application of cottonseed meal-based wood adhesive formulations for small wood item bonding. International Journal of Adhesion and Adhesives. 95:102448. https://doi.org/10.1016/j.ijadhadh.2019.102448.
Interpretive Summary: Wood adhesives have been mainly applied to the production of various wood panels and composites, such as plywood, particle board, oriented strand board, and medium density fiber board. With the benefit of industrial input, we reported in this work our latest data on WCSM bonding performance with high solid contents that was suitable for low temperature applications. Protein denaturing agents guanidine hydrochloride (GdmCl) and sodium dodecyl sulfate (SDS) were added to improve the bonding capability and viscosity of WCSM. were applied as adhesive additives to evaluate their effects on improving the ease of operation. Four adhesives formulations were then used to glue genuine industrial pencil slat sandwiches for pencil-making to demonstrate WCSM's capability as an industrial wood adhesive for non-structural interior application. Per the results of the industrial Temperature Cycle Test and durability data, all four formulations were suitable for the pencil sandwich bonding. However, long bonding time (120 min) is needed for making the pencils passed Temperature Cycle test. This work represents an application for interior structural bonding that would benefit from the bio-based non-toxic glue.
Technical Abstract: The interest in biobased wood adhesives has steadily increased in recent years. In this work, eight water-washed cottonseed meal (WCSM)-based adhesives with high solid content (up to 49%) were formulated and tested for bonding of small wood items at low temperatures (40 C). Chemical denaturing reagents guanidine hydrochloride (GdmCl) and sodium dodecyl sulfate (SDS) were added to improve the bonding capability and viscosity of WCSM. Four formulations with 20% and 30% of WCSM as well as 9.6% and 19.1% of SDS were used to glue genuine industrial pencil slat sandwiches for pencil making. All the pencils made from these sandwiches bonded at 40 C and 1 MPa for 120 min passed the Industrial Temperature Cycle test. The results indicated that WCSM could be used as a low temperature wood adhesive, possibly for the domestic furniture and small utensils niche markets. The pencil sandwich bonding represents a specific application that could benefit from the non-toxic glue and also be an example of an interior application.