Location: Commodity Utilization ResearchTitle: Cottonseed meal-based wood adhesives for non-structural interior applications
Submitted to: Meeting Proceedings
Publication Type: Proceedings
Publication Acceptance Date: 9/6/2017
Publication Date: 10/24/2017
Citation: He, Z., Cheng, H.N., Klasson, K.T., Barroso, V.A.B. 2017. Cottonseed meal-based wood adhesives for non-structural interior applications. In: Hunt, C.G., Smith, G.D., Yan, N., editors. Proceedings of the 2017 International Conference on Wood Adhesives, Forest Products Society, Peachtree Corners, GA. 7 pp.
Interpretive Summary: The interests on biobased wood adhesives have steadily increased in recent years. Per industrial inputs, we tested washed cottonseed meal (WCSM)-based adhesive formulations for possible interior application. These formulations were with high solid contents and suitable for low temperature applications. Specifically, four adhesives formulations were used to glue pencil sandwiches for pencil-making to demonstrate WCSM's capability as an industrial wood adhesive for non-structural interior application. The pencil sandwich bonding work represents a specific application that could benefit from the non-toxic glue and also be an example of an interior application.
Technical Abstract: The interests on biobased wood adhesives have steadily increased in recent years. Whereas soy-based adhesives have been extensively explored, there are very limited studies of cottonseed meal products as wood adhesives. We investigated the bonding performance of water-washed cottonseed meal (WCSM) and cottonseed protein isolate (CSPI) for diverse parameters. Our data showed that water washing significantly improved the water resistance of cottonseed meal-based adhesives. Indeed, WCSM is comparable to or even better than CSPI based on several adhesive performance parameters we tested. Thus, water washing of cottonseed meal is more cost-efficient and environment-friendly than the protein isolation which involves alkaline extraction and acidic precipitation. Using pilot-scale produced WCSM, we further optimized the bonding parameters for non-structural interior applications. Eight WCSM-based adhesives were formulated and tested for bonding of small items at low temperatures (40 oC). Chemical denaturing reagents and longer bonding time were needed to improve the bonding capability of WCSM. Per the experimental data, these WCSM-based adhesive formulations with high solid contents were used to glue the pencil slat sandwich in pencil making. The results indicated that WCSM could be used as low temperature wood adhesives, specified for the domestic furniture and small utensils niche markets. The pencil sandwich bonding work represents a specific application that could benefit from the non-toxic glue and also be an example of an interior application.