Location: Commodity Utilization ResearchTitle: Effects of the particle size on the adhesive strength of washed cottonseed meal with white oak
|Klasson, K Thomas|
Submitted to: Meeting Proceedings
Publication Type: Proceedings
Publication Acceptance Date: 6/25/2017
Publication Date: 6/26/2017
Citation: He, Z., Cheng, H.N., Klasson, K.T. 2017. Effects of the particle size on the adhesive strength of washed cottonseed meal with white oak. In: Proceedings of the 71st Forest Products Society (FPS) International Convention, June 26-28, 2017, Starkville, Mississippi. Track 1.5.1. 4 pp.
Interpretive Summary: Water-washed cottonseed meal (WCSM) is promising as biobased wood adhesives. For promoting the practical application, WCSM has been produced in pilot scale. In this work, we tested the dry, wet, soaked, and heat shear strength of WCSM on bonding white oak veneer. Data of the four adhesive strengths with white oak veneer demonstrated that pilot-produced WCSM was suitable for plywood wood bonding with non-structural internal applications. Information derived from this work increases the performance knowledge of WCSM for developing the industrial standards of WCSM as wood adhesives.
Technical Abstract: Water wash of cottonseed meal is more cost-efficient and environment-friendly than the protein isolation which involves alkaline extraction and acidic precipitation. Thus, water-washed cottonseed meal (WCSM) is more promising as biobased wood adhesives. In this work, we examined the effect of the particle size on the adhesive performance of WCSM. Pilot-scale produced WCSM was grounded by three methods: 1) directly past through a 0.5-mm hammer mill, 2) further ground by UDY mill and past through a 0.5-mm screen, or 3) further ground by a ball mill and past through a 0.18-mm screen. Four strength measurements (dry, wet, soaked, and heat shear strength) were performed with the three samples bonding white oak. The glued joints of the wood specimens were further examined by optical microscopy. Data presented in this work would be useful in developing the industrial standards of WCSM used in wood bonding.