|KHAN, ADIL - Texas Tech University|
|TIAN, RAN - Texas Tech University|
|YIAO, YINPING - Texas Tech University|
Submitted to: Meeting Abstract
Publication Type: Abstract Only
Publication Acceptance Date: 3/14/2022
Publication Date: 3/29/2022
Citation: Khan, A., Tian, R., Xin, Z., Yiao, Y., Chen, J. 2022. Transcriptome analysis of high-temperature stress in sorghum seed development (abstract). Sorghum Improvement Conference of North America, March 28-30,2022, Dallas-Fort Worth, TX.
Technical Abstract: Heat stress affects sorghum at various developmental stages, especially at pollination and grain-filling period, causing significant reductions in grain yield and seed quality. To characterize the impact of high temperature on seed development, we performed a series of heat stress treatment at eight different stages of seed development and examined the global transcriptional dynamic changes in sorghum seeds under normal (28°C), moderate heat stress (35°C-1d, 35°C-3d and heat stress (40°C- 1d, 40°C-3d) conditions. The samples analyzed included development seeds collected from milky (2-5 DAP, 3-6 DAP, 4-7 DAP, 7-10 DAP), soft dough (10-13 DAP, 14-17 DAP), and hard dough (18-21 DAP, 23-25 DAP stages. It was observed that heat stress occurring at milky stage significantly decreased seed size and seed number compared to soft and hard dough stages. Genome-wide transcriptome analysis revealed that heat stress negatively impacts keys genes in starch and protein biosynthetic pathway. Reduced seed size resulted from an abbreviated duration of starch-related metabolism and appears to be limited by endogenous sugars as a result of downregulating Brittle1 (OsBT1) gene under heat stress conditions. This project will provide critical genes as breeding targets to increase the heat resilience of sorghum during seed development.