ARS | Publication request: USE OF CONTOUR ANALYSIS IN MONITORING STORED-PRODUCT INSECTS

Submitted to: Journal of Economic Entomology
Publication Type: Peer Reviewed Journal
Publication Acceptance Date: December 23, 2005
Publication Date: June 20, 2006
Citation: Arbogast, R.T., Chini, S.R., Mcgovern, J.E. 2006. Use of contour analysis in monitoring stored-product insects. Journal of Economic Entomology. 99(3):601-603.

Interpretive Summary: Insect pests are a perennial problem in structures such as grain storage facilities, food processing plants, feed mills, warehouses, retail stores and households, where they damage and contaminate susceptible commodities. Pest management in these situations has relied heavily on chemical insecticides and fumigants such as methyl bromide. With increasing emphasis being placed on integrated pest management to minimize pesticide risk, regular monitoring to detect and locate infestation has assumed greater importance. ARS scientists at the Center for Medical, Agricultural and Veterinary Entomology in Gainesville, Florida, have developed a new monitoring method that uses a combination of trapping and spatial analysis of trap catch by contour mapping. The value of the method lies in its ability to locate as well as detect infestation and in the utility of contour maps for documentation and communication. The maps provide graphic, easily understood evidence of insect infestation and the effectiveness of control measures. They are thus of considerable value in communicating insect problems among managers and maintenance, sanitation, and pest control personnel. The method has been tested in various commercial settings and has proven effective. It will help reduce pesticide risk by guiding the timing and targeting of control applications, eliminating the need for routine preventive treatment, reducing the area treated with insecticides, and aiding in the application of nonchemical methods. The method has already gained some acceptance by the pest control and food processing industries, and acceptance is expected to expand.

Technical Abstract: n/a