Location: Plant Genetics Research
Project Number: 5070-21000-036-06-R
Project Type: Reimbursable Cooperative Agreement
Start Date: Apr 1, 2012
End Date: Dec 31, 2013
To develop an improved understanding of genetics behind a form of resistance heat stress induced degredation during germination. Also, the development of high yielding soybean lines with improved heat stress tolerance during seed germination.
In previous research, an exotic plant introduction line was identified with tolerance to high temperature stress during germination. This line has been crossed to a higher-yielding cultivar and a F5 RIL population has been developed. This population is being analyzed for whole genome marker information and phenotyped for the amount of heat tolerance during germination. This information will be used to genetically map and characterize the genomic locations, and potentially the genetic causes for this trait. In addition, soybean seed composition traits will be evaluated as a potential source of heat tolerance.