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United States Department of Agriculture

Agricultural Research Service

Title: Effects of Wheat Bran and Apple Pomace on Pasting Viscosity and Expansion of Yellow Pea Extrudates

item Garnandez, Rochelle - WASH ST UNIV, PULLMAN
item Berrios, Jose
item Tang, Juming - WASH ST UNIV, PULLMAN
item Swanson, Barry - WASH ST UNIV, PULLMAN

Submitted to: American Association of Cereal Chemists Meetings
Publication Type: Abstract Only
Publication Acceptance Date: July 10, 2003
Publication Date: September 1, 2003
Citation: Garnandez, R.J., Berrios, J.D., Tang, J., Swanson, B.G. 2003. Effects of wheat bran and apple pomace on pasting viscosity and expansion of yellow pea extrudates. American Association of Cereal Chemists Meetings. Abstract #311:134.

Technical Abstract: Legumes, apple pomace, and wheat bran are untapped resources for formulating snack foods to meet the nutritional qualities of health conscious consumers. Yellow split peas (YSP) were extruded with added wheat bran (WB) or apple pomace (AP) at selected concentrations of 5, 10, 15, or 20%. The YSP mixtures were processed in a 37 mm twin-screw extruder at 15% (wb) moisture and a die temperature of 160°C. The objective of this study was to determine the effects of added fiber on pasting curves and bulk density of YSP extrudates. Viscosities of the mixtures before extrusion and the slurries prepared from extrudates were determined using a Rapid Visco Analyser (RVA) to determine initial (IV) 25 degrees (o) C, hot (HV) (95oC), and final (FV) viscosities. Extrudates containing WB expanded more than extrudates containing AP. Before extrusion, the FV of the mixtures were 1859, 793, and 870 cP for YSP alone, YSP/20%WB, and YSP/20%AP, respectively. After extrusion, the FV of the mixtures were 424, 140.5, and 251 cP for YSP flour, YSP/20%WB, and YSP/20%AP, respectively. Characterizing the pasting properties of YSP feed and extruded YSP mixtures containing AP or WB using RVA data is important to understanding extrudate functionality, to optimize cooking parameters and product quality.

Last Modified: 4/21/2015
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