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ARS Home » Pacific West Area » Albany, California » Western Regional Research Center » Healthy Processed Foods Research » Research » Publications at this Location » Publication #190940

Title: PROPERTIES OF PARTICLEBOARD BOND WITH RICE BRAN AND POLYMERIC METHYLENE DIPHENYL DIISOCYANATE ADHESIVES

Author
item Pan, Zhongli
item CATHCART, ANNA - UC DAVIS, DAVIS, CA
item WANG, DONGHAI - KANSAS ST. UNIV., KS

Submitted to: Industrial Crops and Products
Publication Type: Peer Reviewed Journal
Publication Acceptance Date: 3/21/2005
Publication Date: 1/1/2006
Citation: Z. Pan, A. Cathcart, D. Wang, 2006. Properties of particleboard bond with rice bran and polymeric methylene diphenyl diisocyanate adhesives. Industrial Crops and Products. 23(1):40-45.

Interpretive Summary: This research studied the feasibility of using rice bran-based adhesive to replace synthetic adhesive for the production of particleboards. The results showed that up to 30% of synthetic adhesive can be replaced by the rice bran-based adhesive without lowering the particleboard quality.

Technical Abstract: Rice straw can be used as a fiber source for the manufacture of particleboards. Polymeric methylene diphenyl diisocyanate (PMDI) is widely used as an adhesive for manufacturing such products. PMDI has the ability to bind rice straw despite the wax present on the surface of the straw. PMDI's relatively high cost, petroleum origin, and toxicity in it's uncured state are concerns to the rice particleboard industry. A less expensive and environmentally friendly rice bran adhesive may be used to replace a portion of PMDI and still give quality products. The objective of this study was to evaluate the quality of particleboard bond with rice bran-based adhesive. In this experiment, rice bran adhesive (RBA) was used to replace 10, 20, and 30% of PMDI adhesive. The properties of the resulting mixed adhesive products were then evaluated and compared with particleboard bond with only PMDI. Up to 30% of the PMDI could be replaced with RBA to yield products with properties similar to those of PMDI bond particleboard.